Original title: General Office of the People's Government of Jinan City on the promotion of integrated circuit industry
People's governments of the districts and counties, the municipal government departments (units):

Integrated circuit industry is the core of the information industry, and it is the key force leading the new round of scientific and technological revolutions and industrial changes. In order to thoroughly implement the "new period to promote the high-quality development of integrated circuit industry and software industry, a number of policies" (National Development [2020] No. 8) spirit, optimize the industrial development environment, enhance the industry's innovation capacity and quality and efficiency, to promote the high-quality development of the city's integrated circuit industry, the municipal government agreed to put forward the following views.

One, the overall requirements

(a) the general idea. Focus on the smart economy and digital pioneer city construction, will comprehensively enhance the level of integrated circuit industry development as a strategic focus of advanced manufacturing and high-quality development of the digital economy, adhere to the government-led, market-led, enterprise-oriented, strengthen innovation-driven, project-driven, policy-promoted, based on the actual development of the industry, focusing on making up for shortcomings, forging a long board to the development of integrated circuit design and large-scale manufacturing is tightly integrated with the industrial cluster as a breakthrough, and continue to promote the development of integrated circuit industry. Industry clusters as a breakthrough, continuously improve the level of integrated circuit design, accelerate the realization of manufacturing output, effectively expand the scale of packaging and testing, give priority to the development of high-performance integrated circuits, power devices, intelligent sensors and other fields, focusing on breakthroughs in the scale of semiconductor materials and integrated circuits manufacturing, and to promote the integration and development of integrated circuits and application enterprises to create a large-scale, clustered, high-end industrial chain, and to enhance the overall competitiveness of the industry. The overall competitiveness of the industry will be enhanced.

(2) Development Goals. Focusing on high-performance integrated circuits, power devices, intelligent sensors and other sub-fields, improve materials, design, manufacturing, packaging and testing and other industrial links, grow the scale of the industry, and create a first-class industrial ecology. By 2025, the design capability significantly improved, materials, manufacturing, packaging and testing technology and capacity to form a major breakthrough, the industry chain closed-loop ecology is basically formed; to cultivate 8-10 leading enterprises, more than 20 core competitiveness of the leading leading enterprises, the formation of 50 billion yuan of industrial scale, in the field of power devices, IC design to create a highly competitive industrial agglomeration and innovative development of the high ground.

Two key tasks

(a) the implementation of the design of the solid chain project. Give full play to the leading enterprises and integrated circuit public service platform to drive the role of support, increase the integrated circuit design industry technology, talent, capital and other aspects of support, encourage enterprises to grow stronger, tracking and cultivating the core technology of integrated circuit design of small and medium-sized enterprises to grow the scale of the design industry. Support design enterprises to strengthen independent innovation, increase R&D investment, sell independent innovative products, and introduce and cultivate a number of design enterprises with independent intellectual property rights for high-performance integrated circuits, power devices, intelligent sensors and other fields. Give full play to the driving effect of the construction of major industrial ecological projects such as China Computing Valley, China Hydrogen Valley, new energy vehicles, etc., and accelerate the development of encryption and decryption chips, home-made EDA (electronic design automation) tools, home-made FPGA (field-programmable gate array) chips, multimedia chips, AI chips, Internet of Things chips and other related products, and expand the market of servers, AI, intelligent terminals and automotive electronics. (Responsible units: Municipal Bureau of Industry and Information Technology, Municipal Development and Reform Commission, Municipal Bureau of Science and Technology, Municipal Investment Promotion Bureau; the district and county governments and the management committees of functional zones in charge of the towns and streets, hereinafter collectively referred to as the district and county governments)

(b) Implementation of manufacturing chain engineering. Support in line with the national industrial policy of integrated circuit manufacturing major projects, deepen cooperation with the nationally recognized integrated circuit main body of enterprises, promote integrated circuit manufacturing production line construction, accelerate the realization of the benefits of capacity. Support the construction of power semiconductor production lines, guide upstream and downstream enterprises to strengthen cooperation, as soon as possible to form the scale of manufacturing capacity. The construction of production lines to drive the development of key equipment and materials supporting the construction of integrated circuits as the core of the industrial ecosystem. (Responsible units: Municipal Bureau of Industry and Information Technology, Municipal Development and Reform Commission, Municipal Bureau of Science and Technology, Municipal Investment Promotion Bureau, the district and county governments)

(C) the implementation of sealing and testing of the strong chain project. Support the sealing and testing enterprises to increase R & D investment, expand production line capacity, enhance the scale of power devices and smart sensor sealing and testing, encourage upstream and downstream enterprises and sealing and testing enterprises to carry out cooperation, supporting the improvement of the local industrial chain. Actively layout third-generation semiconductor device-level packaging technology R & D and innovation, the introduction of leading domestic and foreign packaging and testing enterprises, and cultivate integrated circuit packaging and testing enterprises with industry influence in niche areas. Focusing on the needs of multimedia chips, artificial intelligence chips and IoT chip design enterprises, integrate technical resources and build high-end chip packaging and testing bases. (Responsible units: Municipal Bureau of Industry and Information Technology, Municipal Development and Reform Commission, Municipal Bureau of Science and Technology, Municipal Investment Promotion Bureau, the district and county governments)

(d) Implementation of the material chain extension project. For new energy vehicles, power electronics, aerospace and other applications market, support enterprises to increase the third generation of semiconductor materials, optoelectronic materials and other R & D efforts and capacity investment, and continue to expand the scale of silicon carbide, lithium niobate and other materials industry; support to increase the high-performance integrated circuits, power devices, intelligent sensors and other applications in the field of new materials R & D investment to promote the local industrialization of high-purity graphite, silicon carbide monocrystalline growth furnace, and to fill the gap in the field of semiconductor materials equipment. Make up for the gap in the field of semiconductor materials and equipment. (Responsible units: Municipal Bureau of Industry and Information Technology, Municipal Development and Reform Commission, Municipal Bureau of Science and Technology, Municipal Investment Promotion Bureau, the district and county governments)

(E) implementation of industrial development support services project. Support backbone enterprises and universities, research institutes to jointly set up integrated circuit industry promotion institutions, gathering advantageous resources, and promoting industrial collaborative innovation and large-scale development. Support pilot demonstrations of applications in key areas such as artificial intelligence, information security, satellite navigation, new energy vehicles, virtual reality, meta-universe and so on. Enhance the level of integrated circuit industry investment and financing services, guide and support investment institutions, application enterprises, integrated circuit enterprises jointly funded the establishment of integrated circuit industry investment fund. Support credit guarantee institutions at all levels to provide financing guarantee services for qualified integrated circuit enterprises. Support enterprises to implement major projects through financial leasing. (Responsible units: Municipal Bureau of Industry and Information Technology, Municipal Bureau of Science and Technology, Municipal Local Financial Supervision Bureau, the district and county governments)

Three policy measures

(a) support the development of enterprise agglomeration. Encourage conditional districts and counties to guide the development of integrated circuit enterprise agglomeration, the key integrated circuit enterprises in the agglomeration area to rent production and R & D office space to give rent subsidies, the first three years in accordance with the actual amount of 70% per annum, 50%, 30% of the annual subsidies, the same enterprise cumulative subsidies totaling no more than 5 million yuan. (Responsible units: Municipal Bureau of Industry and Information Technology, Municipal Bureau of Finance, each district and county governments)

(2) Support the construction and upgrading of public service platforms. Support integrated circuit enterprises, industry alliances, professional organizations, parks and other construction of public service platforms. For the new and annual service enterprises (revenue scale of not less than 5 million yuan) the number of more than 20 platforms, to give no more than 30% of the investment in equipment (including software) one-time financial support, the maximum support of 10 million yuan. For the original integrated circuit public technical service platform, according to the platform maintenance and upgrading of the actual annual investment in equipment (including software), to give no more than 30% of the actual investment in one-time financial support, the maximum support of 10 million yuan. Districts and counties according to their own reality, in accordance with a certain percentage of supporting support. (Responsible units: Municipal Bureau of Industry and Information Technology, Municipal Development and Reform Commission, Municipal Bureau of Science and Technology, Municipal Finance Bureau, the district and county governments)

(c) Support for the construction of key projects. Included in the city's key project library and in line with national industrial policy of the integrated circuit key projects incurred financing costs, in accordance with the annual actual expenditure on financing interest rate of 50% to give a subsidy, the annual subsidy does not exceed 20 million yuan and does not exceed the cost of enterprise financing, the maximum subsidized interest rate for up to three years. (Responsible units: Municipal Bureau of Industry and Information Technology, Municipal Development and Reform Commission, Municipal Finance Bureau)

(d) Support the purchase of R&D tools. IC design companies to buy EDA (Electronic Design Automation) design tools, software, hardware simulation gas pedal and R & D instruments and equipment (equipment original value of more than 100,000 yuan) and other R & D tools, in accordance with the actual costs incurred in 30% of the grant, the total amount of funding for each enterprise annual total of up to 3 million yuan. For enterprises to purchase IP (intellectual property rights) to carry out chip research and development, no more than 30% of the actual cost of funding, the total amount of annual funding per enterprise does not exceed 3 million yuan. For IC EDA design tools R & D enterprises, annual funding of no more than 30% of the actual R & D costs of EDA, the total amount of no more than 10 million yuan. (Responsible unit: Municipal Bureau of Industry and Information Technology, Municipal Bureau of Finance)

(E) support for enterprises to flow. The use of multi-project wafer (MPW) to carry out research and development of design enterprises, to give no more than multi-project wafer direct wafer flow costs 70%, the total annual amount of up to 3 million yuan of funding. For the first time to complete the full mask engineering product wafering design enterprises, not more than 50% of the cost of wafering, the annual total amount of up to 5 million yuan in funding. (Responsible unit: Municipal Industry and Information Technology Bureau, Municipal Finance Bureau) 

(F) support enterprises to carry out packaging and testing. After the completion of the flow of film in the local reliability, compatibility testing and packaging verification of the design of enterprises, to give no more than 50% of the actual cost of subsidies, each enterprise annual subsidies totaling no more than 3 million yuan. (Responsible units: Municipal Bureau of Industry and Information Technology, Municipal Bureau of Finance)

(vii) Encourage enterprises to implement application promotion and extend the industrial chain. Support manufacturing enterprises and integrated circuit enterprises to cooperate in the development of intelligent products, procurement of chip or module products, according to the annual purchase amount of 30% of the award, the maximum award of 1 million yuan. Encourage the city with independent intellectual property rights of the chip products listed on the application of the relevant application areas to carry out industrial synergistic development of pilot demonstration project selection, to give 200,000 yuan one-time award. (Responsible unit: Municipal Industry and Information Technology Bureau, Municipal Finance Bureau)

(H) Strengthen talent support. Encourage integrated circuit enterprises and key universities in Jinan, research institutes, vocational colleges and other institutions to jointly carry out integrated circuit talent orientation training business. Deepen the integration of industry and education, support integrated circuit enterprises and universities to jointly build a modern industrial college, recognized by the provincial level or above, in accordance with the total investment in the construction of 50% of the enterprise to give a one-time award, the maximum award of 5 million yuan. The new introduction of high-end talents for IC enterprises, according to the introduction of talent ladder, in accordance with the "Implementation Opinions on Deepening the Reform of Talent Development System and Mechanisms to Promote Talent Innovation and Entrepreneurship" (Jifa 〔2017〕 No. 16) and "Several Policies on Supporting the Development of Talents' Innovation and Entrepreneurship" (Jihua Group Development 〔2019〕 No. 17), the relevant provisions of the support. (Responsible units: Municipal Party Committee Organization Department, Municipal Science and Technology Bureau, Municipal Finance Bureau)

(ix) Deepen the industrial chain supporting investment. Vigorously promote integrated circuits to achieve the development of the whole industry chain, encourage business investment, stimulate local enterprises to extend the chain to supplement the chain of strong chain of endogenous momentum, the city's existing integrated circuit enterprises to introduce an independent legal personality and single project investment of more than 10 million yuan of ancillary enterprises, in accordance with the in place of the funds of 1% of the recommended business incentives, the maximum award of 1 million yuan, divided into two years of implementation. Strengthen the integrated circuit enterprise settlement guarantee, the newly settled integrated circuit enterprises in the land plant security, financial support, financial contribution incentives and other aspects of the relevant policies can be enjoyed in accordance with the provisions. (Responsible units: Municipal Bureau of Industry and Information Technology, Municipal Development and Reform Commission, Municipal Investment Promotion Bureau, Municipal Finance Bureau)

(10) Improve the investment and financing environment. Implement the relevant provisions of the Jinan City Action Plan to Further Promote the Development of the Capital Market (Jinan Government Development [2018] No. 13), support various types of private equity, venture capital funds to invest in quality integrated circuit enterprises in our city, equity investment funds to invest in our city's non-affiliated integrated circuit enterprises by way of equity investment, for an investment period of more than two years and an investment amount of more than 5 million yuan (investment in a number of integrated circuit enterprises, which can be combined; there are municipal, regional and county government guidance funds and financial funds involved in the capital of the equity investment enterprises, according to the exclusion of government guidance funds and financial contributions to the part of the investment amount), according to the amount of its investment in 2% of the one-time incentive, the maximum incentive of 1 million yuan. (Responsible units: Municipal Local Financial Supervision Bureau, Municipal Finance Bureau)

Office General Office of the People's Government of Jinan Municipality

Jun. 23, 2022

(Contact numbers: Electronic Information Industry Division, Municipal Industry and Information Technology Bureau) , 66602612, 66602621)

(This is a public release)